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Encapsulation of Microelectronic Components Using Open-Ended Microwave Oven

TitleEncapsulation of Microelectronic Components Using Open-Ended Microwave Oven
Publication TypeJournal Article
Year of Publication2012
AuthorsPavuluri, S. K., M. Ferenets, G. Goussetis, M. P. Y. Desmulliez, T. Tilford, R. Adamietz, G. Muller, F. Eicher, and C. Bailey
JournalComponents, Packaging and Manufacturing Technology, IEEE Transactions on
Volume2
Pagination799 -806
Date Publishedmay
ISSN2156-3950
Keywordsautomatic computer-controlled closed feedback loop, curing, curing material, curing temperature cycle, differential scanning calorimeter, differential scanning calorimetry, encapsulation, encapsulation material, infrared pyrometer, microelectronic component, microwave ovens, open-ended microwave oven, polymer dielectric, polymers, real-time measurement, temperature measurement
Abstract

An open-ended microwave oven system is presented and characterized for the rapid encapsulation of microelectronic components. In situ real-time measurement of the temperature of the curing materials is carried out by an infrared pyrometer integrated in the microwave head of the oven. An automatic computer-controlled closed feedback loop has been used to measure the temperature in the curing material and modulate the system operating power to obtain predefined curing temperature cycles for efficient curing. Uniform curing of the encapsulant material is achieved with typical cure time of  300s with a ramp rate of 1.66 #x00B0;C/s and a hold period of  100s . Differential scanning calorimeter based measurement for the curing of the polymer dielectric indicates a near 100% degree of cure.

DOI10.1109/TCPMT.2011.2177524