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Fabrication and Characterization of a Low-Cost, Wafer-Scale Radial Microchannel Cooling Plate

TitleFabrication and Characterization of a Low-Cost, Wafer-Scale Radial Microchannel Cooling Plate
Publication TypeJournal Article
Year of Publication2009
AuthorsDesmulliez, M. P. Y., A. J. Pang, M. Leonard, R. S. Dhariwal, W. Yu, E. Abraham, G. Bognar, A. Poppe, G. Horvath, Z. Kohari, M. Rencz, D. R. Emerson, R. W. Barber, O. Slattery, F. Waldron, and N. Cordero
JournalComponents and Packaging Technologies, IEEE Transactions on
Pagination20 -29
Date Publishedmarch
Keywordsforced convection, heat transfer coefficient, integrated circuit packaging, LIGA, microchannel flow, microelectronic packaging, microfabrication, nickel, nickel-based plate, partial thermal resistance measurement, size 100 mum, size 70 mum, thermal behavior, thermal management (packaging), thermal resistance, two-layer electroforming process, UV-LIGA technology, wafer-scale radial microchannel cooling plate

The modeling, simulation, fabrication, and testing of a microchannel cooling plate for microelectronic packaging applications are described in this paper. The cooling component uses forced convection of gas injected inside 128 microchannels of 100-mu m width and 70-mu m height. The nickel-based plate is fabricated on a glass substrate using a two-layer electroforming process using UV-LIGA technology. The thermal behavior of the microchannel cooling device is investigated by using the measurement of partial thermal resistances through the use of the structure functions method. Heat transfer coefficient values of 300 W/m2 K have been measured for a nitrogen flow rate of 120 l/h.