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Novel dual layer electroformed stencils for high resolution LTCC circuit manufacture

TitleNovel dual layer electroformed stencils for high resolution LTCC circuit manufacture
Publication TypeConference Proceedings
Year of Conference2011
AuthorsKay, R., G. Cummins, J. Terry, M. P. Y. Desmulliez, and A. J. Walton
Conference NameEngineering Packaging and Technology Conference (EPTC)
Pagination507-512