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Progress towards filling through silicon vias with conductive ink

TitleProgress towards filling through silicon vias with conductive ink
Publication TypeConference Paper
Year of Publication2012
AuthorsCummins, G., J. H. - G. Ng, R. Kay, J. Terry, M. P. Y. Desmulliez, and A. J. Walton
Conference NameEngineering Packaging and Technology Conference (EPTC)
Abstract

Inkjet printing is a promising additive manufacturing technology that is being increasingly used in applications such as displays, electronics and electronic packaging. Through Silicon Vias (TSVs) is an important enabling technology for advanced electronic packaging. The direct write nature of inkjet printing would also allow flexible packaging solutions through the cheap and sustainable filling of vias. This paper describes the progress to date with using this printing technology to fill TSVs and some of the challenges encountered to date.