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Surface embossing of LTCC during the lamination process

TitleSurface embossing of LTCC during the lamination process
Publication TypeConference Paper
Year of Publication2012
AuthorsWilhelm, S., and M. P. Y. Desmulliez
Conference NameDesign, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2012 Symposium on
Date Published04/2012
Keywordsbump arrays, ceramic packaging, embossing, isostatic lamination, lamination process, laminations, low temperature cofired ceramics technology, LTCC package, microchannels, self constrained ceramics HL2000, structured metal sheet, surface embossing
Abstract

This paper presents an embossing technique that allows a reduction of manufacturing steps by patterning the top and bottom faces of an LTCC package during isostatic lamination using a structured metal sheet. Two examples of micro-channels and bump arrays are presented for self constrained ceramics HL2000.