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Microstructure and electrical property of copper films on a flexible substrate formed by an organic ink with 9.6 % of {Cu} content

TitleMicrostructure and electrical property of copper films on a flexible substrate formed by an organic ink with 9.6 % of {Cu} content
Publication TypeJournal Article
Year of Publication2015
AuthorsYang, W-dong., C-hai. Wang, V. Arrighi, C-yan. Liu, and D. E. Watson
JournalJournal of Materials Science: Materials in Electronics
Volume26
Pagination8973–8982
ISSN1573-482X
Abstract

An organic copper ink with 9.6 wt% of Cu content derived from a short carbon chain organic copper precursor was successfully applied on a modified PI substrate and easily formed a favorable conductive copper film by self-reduction in the sintering process, which showed excellent conductivity. The effects of sintering temperature and time on the microstructure and conductivity action of the copper films were studied by XRD, EDS and SEM and electrical measurements, respectively. The sheet resistance and resistivity were determined to be as low as 0.11 Ω/□ and 2.2 × 10−5 Ω·cm. The conduction mechanism is discussed in terms of the percolation theory.

URLhttp://dx.doi.org/10.1007/s10854-015-3580-4
DOI10.1007/s10854-015-3580-4