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Fabrication and Characterisation of a Metal-based Microchannel Cooling Plate

Marc Desmulliez, Weixing Yu
The rapid advances in transistor density and switching frequency of VLSI circuits have induced dramatic increases in die heat flux and power consumption at all levels of electronic packaging... [read more]

The rapid advances in transistor density and switching frequency of VLSI circuits have induced dramatic increases in die heat flux and power consumption at all levels of electronic packaging. Such increases in thermal dissipation have motivated the demand for more efficient cooling mechanisms at the die, component, PCB and system levels. Metal-based microchannel cooling plate fabricated by UV-LIGA process has the advantage of wafer-level processing and easily integrated with electronic package. Microchannels with I-type, Y-type and Bio-mimetic design have been successfully fabricated in Nickel or Copper with size down to 20um and aspect ratio up to 3.5. The flow rate and thermal resistant of the cooling plates has been measured and a heat transfer coefficient of 511W/m2K at a flow rate of 120l/hr has been obtained .