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Flip Chip Assembled MEMS Inductors for Wireless Communications

Jun Zeng, Changhai Wang
The aim of this project is to develop suspended MEMS inductors for wireless communications applications ... [read more]

The aim of this project is to develop suspended MEMS inductors for wireless communications applications. Current IC process based micro-inductors suffer from low Q-factor due to substrate conductivity and will be a limiting factor in the performance of next generation RF integrated circuits. A new technique based on flip chip assembly has been developed for producing suspended MEMS inductor devices. Meander line and spiral inductors have been fabricated and assembled with an gap between the inductor structure and the substrate to reduce the parasitic losses. The devices have been characterised using coplanar probes and a microwave network analyser. Q-factor of ~ 20 after pad de-embedding has been obtained at ~ 2.5 GHz.