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Frequency Agile Microwave Oven Bonding System

Marc Desmulliez, George Gousettis, Sumanth Kumar Pavuluri, Keith Sinclair
A novel open-ended microwave oven in the form of a waveguide cavity partially filled with dielectric is presented for combined spatially selective and uniform curing during flip-chip assembly. [read more]

A novel open-ended microwave oven in the form of a waveguide cavity partially filled with dielectric is presented for combined spatially selective and uniform curing during flip-chip assembly. By adjusting the dimensions and the dielectric permittivity, a well defined resonance can be confined in the dielectric part with non-radiating evanescent decaying fields in the remaining of the cavity. Curing occurs by virtue of the energy stored in localised evanescent field maxima. Careful selection of the resonance order through ‘targeted mode jittering’ controls the locations of the electric field maxima (hot-spots). The dielectric to air interface enhances the longitudinal electric field. The proposed device offers enhanced flexibilities for the curing of bumps, underfills and encapsulants, as well as the alignment of devices for fast flip-chip assembly, direct chip attach (DCA) or wafer-scale level packaging (WSLP). The improved open ended oven system is integrated with a robotic placement machine. A closed loop feedback control block diagram consisting of the necessary standard RF components, temperature sensor, data interfaces, and computer with a Labview™ program has been developed to drive the open ended oven inorder to achieve efficient EM fields in the heating region. This control system, monitors the heating temperature and has the potential to stipulate temperature ramp up and down rates, multiple hold temperatures and curing time intervals.

 

  

Journal articles

  1. T. Tilford, K. I. Sinclair, C. Bailey, M. P. Y. Desmulliez, G. Gousettis, A. K. Parrott and A. J. Sangster, “Multiphysics Simulation of Microwave Curing in Micro-Electronics Packaging Applications,” Journal of Soldering and Surface Mount Technology, vol. 19, no. 3, pp. 26-33, 2007.
  2. J. Sangster and K. I. Sinclair, “Multi-mode degenerate mode cavity for hyperthermia treatment,” IEE Proc. Microwaves, Antennas & Propagation, vol. 153, no. 1, pp.75-82, 2006.
  3. J. Sangster, K. I. Sinclair, M. P. Y. Desmulliez and G. Gousettis, “Open-Ended Microwave Oven for Flip-Chip Assembly,” IET Microw. Ant. & Propag., vol. 2, no. 1, pp. 53–58, February 2008.
  4. K. I. Sinclair, G. Gousettis, M. P. Y. Desmulliez, A. J. Sangster, T. Tilford, C. Bailey and A. K. Parrott, “Optimisation of an Open-Ended Microwave Oven for Microelectronics Packaging,” IEEE Transactions on Microwave Theory and Techniques, vol. 56, no. 11, pp. 2635-2641, 2008
  5. T. Tilford, M. Ferenets, J. E. Morris, A. Krumme, S. Pavuluri, P. R. Rajaguru, M. P. Y. Desmulliez and C. Bailey, "Application of Particle Swarm Optimisation to Evaluation of Polymer Cure Kinetics Models", Journal of Algorithms & Computational Technology Vol. 4 No. 1, 2009

Conferences                        

  1. SINCLAIR, K.I., DESMULLIEZ, M.P.Y., SANGSTER, A.J., “A Novel RF-curing Technology for Microelectronics and Optoelectronics Packaging,” 1st Electronics System-integration Technology Conf. (ESTC), Dresden, Germany, Sep. 2006.
  2. SINCLAIR, K.I., DESMULLIEZ, M.P.Y., SANGSTER, A.J., GOUSETTIS, G., TILFORD, T., BAILEY, C. and PARROTT, A.K., “Open-Ended Microwave Oven for Flip-Chip Assembly,” IEEE Proc. European Microwave Conference, Munich, Germany, pp.620-623, Sep. 2007.
  3. TILFORD, T., SINCLAIR, K.I., BAILEY, C., DESMULLIEZ, M.Y.D., PARROTT, A.K. and SANGSTER, A.J., “Multiphysics Simulation of Microwave Curing of Polymer Materials in Microelectronics Packaging Applications,” Proceedings 11th International Conference on Microwave and High Frequency Heating, Oradea, Romania, pp.189-192, 2007.
  4. TILFORD, T., SINCLAIR, K.I., BAILEY, C., DESMULLIEZ, M.Y.D., PARROTT, A.K. and SANGSTER, A.J., “Coupled FDTD-FVM Simulation of Microwave Heating of Polymer Materials for Micro-Systems Packaging Applications,” Proceedings 41st International Microwave Power Institute Symposium, Vancouver, Canada, pp.7-12, 2007.
  5. TILFORD, T., SINCLAIR, K.I., BAILEY, C., DESMULLIEZ, M.Y.D, PARROTT, A.K. and SANGSTER, A.J, “Coupled FDTD-FVM Simulation of Microwave Heating of Polymer Materials for Micro-Systems Packaging Applications,” Proceedings of Electronics Packaging Technology Conference, Singapore, 2007.
  6. T. Tilford, K.I. Sinclair, G. Goussetis, C. Bailey, M.P.Y. Desmulliez, A.K. Parrott and A.J. Sangster, ‘Numerical Analysis of Thermal Stresses Induced During VFM Encapsulant Curing’, Proceedings International Spring Seminar on Electronics Technology (ISSE 2008), Budapest, Hungary, pp.176-177, ISBN: 978-963-06-4915-5.
  7. SINCLAIR, K.I., TILFORD, T., DESMULLIEZ, M.P.Y., GOUSETTIS, G, BAILEY, C., PARROTT, A.K. and SANGSTER, A.J, “Open Ended Microwave Oven for Packaging,” Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS, France, 2008, ISBN: 978-2-35500-006-5.
  8. K. I. Sinclair, G. Goussetis, M. P. Y. Desmulliez, A. J. Sangster, T. Tilford, C. Bailey and A. K. Parrott, “Polymer Curing within an Open-Ended Microwave Oven,” EuMW Conference (Amsterdam), 2008.
  9. K. I. Sinclair, T. Tilford, G. Goussetis, C. Bailey, M. Y. P. Desmulliez, A. K. Parrott, A. J. Sangster, “Advanced Microwave Oven for Rapid Cure of Encapsulants,” ESTC 2008, Greenwich, London, 2008.
  10. T. Tilford, S. Pavuluri, C. Bailey and M. P. Y. Desmulliez, ‘On Variable Frequency Microwave Processing of Heterogeneous Chip-on-Board Assemblies’, Proc. International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2009), Beijing, China. ISBN: 978-1-4244-4659-9, pages 927 – 931
  11. T. Tilford, K. I. Sinclair, C. Bailey, S. Pavuluri and M. P. Y. Desmulliez, ‘On the Application of Variable Frequency Microwave Technology for Processing of Individual Surface Mount Components’, Proc. 2009 International Conference on Electronics Packaging, pp. 498–503, 2009.
  12. T. Tilford, M. Ferenets, J. E. Morris, P. R. Rajaguru, S. Pavuluri, M. P. Y. Desmulliez and C. Bailey, ‘Evaluation of Polymer Cure Models in Microelectronics Packaging Applications ‘, Proc International Conference on Electronics Packaging, Sapporo, Japan, 2010, pp. 417 – 424.
  13. S.K. Pavuluri, T Tilford , G. Goussetis, M. P. Y Desmulliez, M Ferenets and C. Bailey, “Advances in the design and test of novel open ended microwave oven “, Design, Test, Integration & Packaging of MEMS/MOEMS Symposium, Seville, Spain, 5-7 May 2010
  14. S.K. Pavuluri, M. Ferenets, G. Goussetis, M. P. Y. Desmulliez, T. Tilford, R. Adamietz, G. Muller, F. Eicher and C. Bailey, “Experimental Investigation of Open-Ended Microwave Oven Assisted Encapsulation Process” Proc.3rd Electronics Systemintegration Technology Conference, 2010, Berlin, Germany
  15. T. Tilford, M. Ferenets, R. Adamietz, S. Pavuluri, J. E. Morris, M. P. Y. Desmulliez, C. Bailey “Numerical Analysis of Microwave Underfill Cure in Ball-Grid Packages”, Proc.3rd Electronics Systemintegration Technology Conference, 2010, Berlin, Germany
  16. T. Tilford,  J. E. Morris, M. Ferenets, P. R. Rajaguru  S. Pavuluri, M. P. Y. Desmulliez, C. Bailey “On Model Fitting Methods for Analysis of Polymer Cure Kinetics in Microelectronics Assembly A pplications”, Proc.3rd Electronics Systemintegration Technology Conference, 2010, Berlin, Germany
  17. R. Adamietz, G. Müller, N. Othman, F. Eicher, T. Tilford, M. Ferenets, S. Pavuluri, M. P. Y. Desmulliez, C. Bailey “On the Integration of Microwave Curing Systems into Microelectronics Assembly Processes”, Proc.3rd Electronics Systemintegration Technology Conference, 2010, Berlin, Germany

Patents                 

  1. A.J. Sangster, K.I. Sinclair, M.P.Y. Desmulliez, “Frequency Agile Microwave Oven Bonding System,” UK Patent No. GB0711986, 2007.
  2. K.I. Sinclair, A.J. Sangster, M.P.Y. Desmulliez, and G. Goussetis, "Frequency agile microwave oven bonding system," UK Patent No. GB0819335.1, 2008.