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High Density bumps for Micro-LED Array Flip-Chip Packaging

David Flynn, Marc Desmulliez, Weixing Yu
Micro-LED array as micro-light emitters has many potential applications in many areas such as microscopy, lab-on-chip screening and mask-free lithography et al.

Micro-LED array as micro-light emitters has many potential applications in many areas such as microscopy, lab-on-chip screening and mask-free lithography et al. Flip-chip packaging makes it possible to integrate the micro-LEDs in a high density in a matrix-addressed format so that the individual LED can be operated independently. MISEC has the capability of UV-LIGA processing and flip-chip bonding. The task undertaken by MISEC is to fabricate the high density bumps with a diameter down to 20┬Ám or even smaller (which means the possibility to integrate 1000 micro-LEDs in a 1mm2 area) and also to bond the Micro-LED array onto the substrate.