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Laser Assisted Polymer Bonding for MEMS Packaging

Marc Desmulliez, Changhai Wang, Jun Zeng, Yufei Liu
Microscale bonding and joining is a key process in manufacture of MEMS based products for encapsulation, assembly and packaging ... [read more]

Microscale bonding and joining is a key process in manufacture of MEMS based products for encapsulation, assembly and packaging. Laser assisted bonding process offers several advantages over the conventional approaches including remote heat source, fast and localised heating effect. We have developed a laser based polymer bonding process for fast, low temperature packaging of MEMS and other temperature sensitive microdevices and systems. The polymer structures for bonding are produced on caps or capping wafers and are then bonded to the device chips/wafers using laser heating effect. Fast and reliable bonding has been demonstrated with a bonding time of several seconds.