You are here

The Application of LTCC and LCP technology in Microsystems Engineering and Opto-Electronic Devices

Yves Lacrotte, Marc Desmulliez
The main objective of this project is to develop packaging capabilities based on LTCC or LCP manufacturing technology. This technology platform is to be used for the production of optoelectronic packages ... [read more].

The main objective of this project is to develop packaging capabilities based on LTCC or LCP manufacturing technology. This technology platform is to be used for the production of optoelectronic packages.
While LCP technology is very recent, LTCC has been used in packaging for more than 15 years in Electronic mostly, but increasingly now in other field such as microfluidic and optics. LTCC is a promising technology due to its way of fabrication (multilayer of independent soft green tape ceramic collated together and fired at around 850°C) allowing 3D structures to be created in it, but also embedding of printed conductor lines in between. Here below is a state of the art LTCC-based transmitter and receiver with the passive optical alignment of fiber to VCSEL/detector, left, and two transceiver modules with electronics components and fibre support, right. The transmitter consists of 10 GHz 850 nm VCSEL and laser driver chips while the receiver is a photodiode and linear amplifier chips mounted on it (Y.X.Guo, L.C.Ong and al).